Current Chip Fabrication Methods are Extremely Expensive and Hard to Change
Modern chip fabs are enormous, multi-billion-dollar facilities with limited versatility in what they can produce. This bottleneck restricts the ability to create assemblies with diverse molecular components on a small scale.
Foundational Capabilities (6)
Develop methods for producing smaller, more diverse assemblies using patterned techniques that allow for greater molecular variability.
Broaden the capabilities of existing chip fabrication facilities to produce a wider range of devices, potentially reducing costs and expanding functionality.
Develop modular electronic components at the nanoscale, enabling flexible, low-cost assemblies with high molecular diversity.
Explore methods to assemble chips using randomized DNA as a templating or assembly tool, allowing for scalable production with inherent molecular diversity.
Use digital techniques to plan and assemble chip components, integrating computational design with physical fabrication.