Next-Gen 3D Integration of Discrete Components
New logic and memory technologies based on CNTs or other structures, 3D integration with fine-grained connectivity, and new architectures for computation immersed in memory
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R&D Gaps (2)
For over five decades, silicon-based CMOS technology has driven unprecedented progress in computing and information technology through dimensional scaling following Moore's Law. This miniaturization has led to exponential increases in transistor density, performance, and energy efficiency. However, as transistor channel dimensions shrink below a few nanometers, silicon and conventional bulk semiconductors (e.g., SiGe, III-V materials) are encountering insurmountable fundamental physical and material limits (heat dissipation, short-channel effects, etc.).
Modern deep learning and general computation demand enormous energy, limiting scalability and sustainability. Addressing energy efficiency is critical for the next generation of computing platforms, though it also supports potential proliferation of advanced AI and should be advanced alongside AI safety and governance considerations.